Manufacturing Insights Skills® Training

Module 4 - Semiconductor Assembly Engineering Series

 

 

  

SE01: Semiconductor Tooling Quality & Performance

 

Course Contents (2-day training):

  1. Tooling Materials Understanding
  2. Tool Making Process and Control
  3. Transfer Mould Quality & Performance
  4. Trim & Form Tool Quality & Performance

 

 

 

SE02: Leadframe Materials & Trim-and-Form Quality

 

Course Contents (2-day training):

  1. Leadframe Structure & Quality Issues
  2. Leadframe Materials & Characteristics
  3. Leadframe Sheared Edge Finish and Control
  4. Leadframe Formability & Processing Control

 

 

SE03: Encapsulation Materials & Transfer Moulding Control

 

Course Contents (2-day training):

  1. Moulding Compound Understanding
  2. Encapsulant Properties  & Encapsulantation Requirement
  3. Transfer Moulding Process  
  4. Materials and Process Optimization

 

 

SE04: Hardening & Surface Coating for Semiconductor Tooling

 

Course Contents (2-day training):

  1. Metallurgical Principle of Heat Treatment
  2. Hardening Process & Common Problems
  3. Hard Surface Coatings Techniques
  4. Hard Surface Coatings Quality

 

 

SE05: Microelectronic Package Defects Understanding and Prevention

 

Course Contents (2-day training):

  1. Residual Stress & Warpage
  2. Delamination & Cracking
  3. Corrosion Failures
  4. Electrical Migration & Tin Whisker

 

 

 

 

     
 

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